At least Micron mentioned availability a couple of weeks ago when they announced 3D NAND for mobile. "3D NAND-based multichip packages (MCPs) also include low power LPDDR4X, providing up to 20 percent more energy efficiency than standard LPDDR4 memory" http://investors.micron.com/releasedetail.cfm?Rele... On the SoC side i haven't spotted support listed on anything besides the Helio P20 and that one is supposed to ship this year. Maybe with a bit more digging there is more info out there on timing, one has to assume that Samsung wasn't slower than others.
I would like to see HBM or HBM2 as system memory. I would like to buy 15 32GB dies with interposer integrated in the motherboard. Then, if i needed it i would increment the memory of the system using DDR4. (i will probably not need it). I think HBMx as sytem memory is the future and not the combination DDR5 and 3D xpoint they want us to sell. I would buy motherboards with integrated memory.
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jjj - Tuesday, August 23, 2016 - link
You talk about LPDDR4X like it's for the future but it's already available and at least the MTK P20 is known to support it.Ryan Smith - Tuesday, August 23, 2016 - link
LPDDR4X is not supposed to be available until next year. If there's anything on the market with it right now, that would be news to me.jjj - Tuesday, August 23, 2016 - link
At least Micron mentioned availability a couple of weeks ago when they announced 3D NAND for mobile."3D NAND-based multichip packages (MCPs) also include low power LPDDR4X, providing up to 20 percent more energy efficiency than standard LPDDR4 memory"
http://investors.micron.com/releasedetail.cfm?Rele...
On the SoC side i haven't spotted support listed on anything besides the Helio P20 and that one is supposed to ship this year.
Maybe with a bit more digging there is more info out there on timing, one has to assume that Samsung wasn't slower than others.
zepi - Tuesday, August 23, 2016 - link
If I/O power is in such a big role, why don't we see more eDRAM solutions in SOC space to alleviate the issue?Or is it just that DRAM processes are so incompatible with logic optimised processes, that it doesn't work out?
asmian - Tuesday, August 23, 2016 - link
> one of the fundamental tenants of HBMYou mean "tenet".
bartoni - Tuesday, August 23, 2016 - link
I'm at HotChips. Where & when were these memory presentations?AnnonymousCoward - Tuesday, August 23, 2016 - link
Samsung's slide shouldn't say "power efficiency". It's the inverse, power usage, in mW/GBps.bobbozzo - Tuesday, August 23, 2016 - link
The HBM acronym isn't defined anywhere on this page... presumably High Bandwidth Memory?Ryan Smith - Tuesday, August 23, 2016 - link
Yes.BillyONeal - Wednesday, August 24, 2016 - link
> So a die stack with fewer TSVs will be easier to manufacturer.There's an extra R on manufacture :)
joniale - Thursday, August 25, 2016 - link
I would like to see HBM or HBM2 as system memory. I would like to buy 15 32GB dies with interposer integrated in the motherboard. Then, if i needed it i would increment the memory of the system using DDR4. (i will probably not need it).I think HBMx as sytem memory is the future and not the combination DDR5 and 3D xpoint they want us to sell.
I would buy motherboards with integrated memory.