Memory
The CXL consortium has had a regular presence at FMS (which rechristened itself from 'Flash Memory Summit' to the 'Future of Memory and Storage' this year). Back at FMS 2022, the company had announced v3.0 of the CXL specifications. This was followed by CXL 3.1's introduction at Supercomputing 2023. Having started off as a host to device interconnect standard, it had slowly subsumed other competing standards such as OpenCAPI and Gen-Z. As a result, the specifications started to encompass a wide variety of use-cases by building a protocol on top of the the ubiquitous PCIe expansion bus. The CXL consortium comprises of heavyweights such as AMD and Intel, as well as a large number of startup companies attempting to play in different segments on...
SK Hynix: We're Planning for DDR5-8400 at 1.1 Volts
Back in November last year, we reported that SK Hynix had developed and deployed its first DDR5 DRAM. Fast forward to the present, and we also know SK Hynix...
86 by Gavin Bonshor on 4/3/2020
Micron to Start Volume Production of 128-Layer 3D NAND with RG Architecture This Quarter
As part of the company's second quarter financial earnings call, Micron has revealed that it is about to start volume production of its 4th Generation 3D NAND memory devices...
10 by Anton Shilov on 4/1/2020
Cadence DDR5 Update: Launching at 4800 MT/s, Over 12 DDR5 SoCs in Development
JEDEC still has not published the DDR5 specification officially, yet it looks like DRAM makers and SoC designers are preparing for the DDR5 launch at full steam. Cadence, which...
20 by Anton Shilov on 3/27/2020
TeamGroup Announces 32GB T-Force Vulcan Z and Dark Z DDR4 Modules
One of the world's largest DRAM memory manufacturers TeamGroup has unveiled its first DDR4 memory kits featuring 32 GB sticks under its gaming-focused T-Force brand. The T-Force Vulcan Z...
7 by Gavin Bonshor on 3/27/2020
Samsung to Produce DDR5 in 2021 (with EUV)
Samsung is on track to start volume production of DDR5 and LPDDR5 memory next year using a manufacturing technology that will take advantage of extreme ultraviolet lithography (EUVL). In...
20 by Anton Shilov on 3/25/2020
GlobalFoundries & Everspin Extend MRAM Pact to 12nm
GlobalFoundries and Everspin have announced that the two have extended their Spin-transfer Torque (STT-MRAM) joint development agreement (JDA) to 12LP (12 nm FinFET) platform. The extension will enable GlobalFoundries...
4 by Anton Shilov on 3/13/2020
Rambus Develops HBM2E Controller & PHY: 3.2 Gbps, 1024-Bit Bus
The latest enhancements to the HBM2 standard will clearly be appreciated by developers of memory bandwidth-hungry ASICs, however in order to add support of HBM2E to their designs, they...
42 by Anton Shilov on 3/6/2020
ATP’s DDR4-3200 Industrial DIMMs: Up to 128GB @ 1.2V for AMD & Intel
ATP has unveiled its latest memory modules for servers and industrial applications, boasting a 3200 MT/s data transfer rate, an industry-standard voltage, and capacities ranging from 2 GB to...
7 by Anton Shilov on 3/5/2020
Samsung Starts Production of 16 GB LPDDR5-5500 for Smartphones
Samsung has begun mass production of the industry’s first 16 GB LPDDR5 memory for upcoming smartphones, such as the Galaxy S20 Ultra 5G handsets. The new DRAM devices not...
33 by Anton Shilov on 2/25/2020
SMART Modular Reveals 32 GB DDR4-3200 Low Profile Mini-DIMMs for Extreme Environments
SMART Modular has unveiled a new lineup of 32 GB Mini-DIMMs for extreme environments, such as industrial or telecommunication applications. The new high-density modules come in ULP (Ultra Low...
7 by Anton Shilov on 2/14/2020
G.Skill Launches 256 GB DDR4-3600 CL16 Memory Kit
The arrival of 32 GB unbuffered DIMMs has not only allowed mainstream systems to reach 128 GB of memory, but it's also allowed high-end desktops based on AMD Ryzen...
8 by Anton Shilov on 2/12/2020
SK Hynix Licenses DBI Ultra Interconnect for Next-Gen 3DS and HBM DRAM
SK Hynix has inked a new broad patent and technology licensing agreement with Xperi Corp. Among other things, the company licensed the DBI Ultra 2.5D/3D interconnect technology developed by...
9 by Anton Shilov on 2/11/2020
GIGABYTE Launches Designare DDR4-3200 Memory, a 64 GB Kit
GIGABYTE is a relatively new player on the memory market, yet it clearly wants to participate in the premier league. As seen at CES, this week the company introduced...
23 by Anton Shilov on 2/6/2020
Micron Shipping LPDDR5 DRAM
Micron has announced their first LPDDR5 DRAM is in mass production and now shipping to customers. The new RAM is significantly faster and more power efficient than LPDDR4x. One...
33 by Billy Tallis on 2/6/2020
JEDEC Updates HBM2 Memory Standard To 3.2 Gbps; Samsung's Flashbolt Memory Nears Production
After a series of piecemeal announcements from different hardware vendors over the past year, the future of High Bandwidth Memory 2 (HBM2) is finally coming into focus. Continuing the...
24 by Ryan Smith on 2/3/2020
SK Hynix to Cut CapEx, Accelerate Transitions, 1z nm DRAM & 128L 4D NAND in 2020
Following a massive revenue and profitability drop in 2019, SK Hynix has announced that it plans to cut down its capital expenditures. While the market has shown some signs...
6 by Anton Shilov on 2/3/2020
Crucial’s 32 GB UDIMMs and SODIMMs Available: DDR4-2666 & DDR4-3200
In the summer of 2019, Crucial was among the first brands to demonstrate 32 GB unbuffered memory modules, which were based on Micron’s 16 Gb DDR4 chips. Now after...
12 by Anton Shilov on 1/29/2020
The Corsair DDR4-5000 Vengeance LPX Review: Super-Binned, Super Exclusive
The consumer memory industry has been teasing DDR4-5000 for a few months now. We saw one company show some DDR4-5000 modules at Computex back in July 2019, running...
56 by Gavin Bonshor on 1/27/2020
Here's Some DDR5-4800: Hands-On First Look at Next Gen DRAM
Just like all major makers of DRAM, SK Hynix produced its first DDR5 memory chips a couple of years ago and has been experimenting with the technology since then...
39 by Anton Shilov on 1/13/2020
CES 2020: Kingston’s HyperX Adds 32 GB UDIMMs & New Fury Speed Bins to Lineup
Kingston’s HyperX division introduced a stack of new memory modules at CES 2020. Firstly, the company added 32 GB unbuffered DIMMs and SO-DIMMs to its Fury and Impact families...
11 by Anton Shilov on 1/10/2020
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